Softprom signs a distribution agreement with Cadence.

News | 05.08.2020

August, 2020 - Softprom, a value-added IT distributor in Europe and CIS, announced the signing of a distribution agreement with Cadence Design Systems, Inc., a global computational software company that delivers products based on design excellence and systems innovation.

Under the terms of the contract, Softprom obtained the right to distribute Cadence products in the following countries: Azerbaijan, Armenia, Belarus, Georgia, Kazakhstan, Moldova, Uzbekistan and Ukraine.

This partnership strengthens Cadence's position in the former CIS markets and complements the Softprom portfolio with new high-level solutions for electronic device design.

For many years, Cadence has been an industry leader. In particular, Cadence® software resolves these challenges:

  • Design of modern analogue and digital circuits; 
  • Analysis of electromagnetic and electrothermal effects of semiconductors, cases, boards and systems.

Softprom has years of expertise addressing the needs of the Europe and CIS markets, and the new distribution agreement can help us grow our presence more broadly in the region. 

We’re looking forward to working with Softprom more closely to enable customers to achieve design excellence with our tools across the latest application areas.

Tabish Khan, Sales director at Cadence.

The Cadence AWR Design Environment® solution, which was already available in the Softprom sales list, provides microwave modelling of wireless communications - from base stations and mobile phones to satellite communications systems. The new distribution agreement encompasses the AWR Design Environment platform as well as a number of additional products, including the well-known Cadence Sigrity™, Allegro® and OrCAD™ technologies and the recently launched Clarity™ 3D Solver and Celsius™ Thermal Solver.

Clarity 3D Solver: A state-of-the-art full 3D electromagnetic solver that includes industry-leading distributed multiprocessing technology, enabling it to solve electrically large and complex PCB, IC package and system-on-chip (SoC) designs efficiently and up to 10X faster.

Celsius™ Thermal Solver: A complete electrical-thermal co-simulation solution for ICs, packages and modules. The Celsius Thermal Solver includes both transient as well as steady-state analysis and is fully integrated into Cadence IC, package and PCB tools, greatly simplifying the thermal design flows.

Sigrity technologies​: Include 3D capabilities that enable PCB design teams to accelerate design cycles while optimizing cost and performance. 

Allegro technologies: Help companies shorten the overall design process by improving both individual and team productivity, easily minimizing rework by bringing more and more of the post-design verification and analysis process into the early design stages.

OrCad technologies: A low-cost solution for developing circuit boards, which includes a circuit editor, a circuit board editor, a restriction and rule manager, an autorouter, and signal integrity analysis functions.

 Cadence solutions have been used successfully by global electronic device developers for many years, and the company has come to be known as a reliable provider that enables optimal product modelling. The new distribution agreement with Cadence provides additional opportunities for Softprom’s customers in market segments including the mobile communications, IoT, radio electronics, automotive and aerospace industries.

Sergiy Taboranskiy, Business Development Manager of Cadence's products, company Softprom.