How STULZ solutions solve the cooling challenge for AI

Artificial intelligence (AI) is radically rewriting the rules of modern data center design and operation. Computing architectures for training large-scale models require the concentration of colossal power—metrics of 136 kW per rack and more have become the new reality. However, the main threat to equipment lies not only in the amount of heat generated, but in its unpredictable dynamics. This is precisely where the technological potential of solutions from STULZ is revealed.

Unlike classic servers, AI platforms operate in pulses: an instantaneous transition to maximum computing power creates a sharp thermal spike, which fades just as quickly during pauses. Traditional climate systems simply do not have time to react to such fluctuations, leading to localized overheating of processors and degradation of microcircuits. To stabilize such environments, the STULZ brand has developed specialized solutions that ensure absolute thermal stability of the infrastructure.

Expert response from STULZ: technologies for extreme workloads

German engineering from STULZ has reimagined approaches to liquid and hybrid cooling. Instead of basic scaling of airflow volume, the company introduces intelligent static control based on continuous differential pressure (delta-p). This allows the system to instantly adapt the speed and volume of the coolant to the real second-by-second needs of graphics processing units (GPUs), neutralizing any risks of thermal shock.

Comparison of cooling system efficiency under AI workloads

Standard climate systems

• Reaction to peaks: Delayed regulation due to sensor inertia, causing critical overheating at the start of computations.
• Flow control: Static algorithms not designed for constant pulse spikes in pressure and temperature.
• Efficiency limit: Lose efficiency and reach physical limits at densities above 50-70 kW per rack.

Innovative STULZ solutions

• Reaction to peaks: Predicted and instantaneous heat dissipation thanks to integration with Direct-to-Chip (DLC) and highly efficient cooling distribution units (CDU).
• Flow control: Dynamic automatic adjustments based on differential pressure in real time.
• Efficiency limit: Engineered for uninterrupted operation in ultra-high-density zones with workloads of 136+ kW per rack.

"STULZ solutions were not created to adapt to standard data centers, but to overcome the physical challenges brought by artificial intelligence technologies."

Comprehensive integration from Softprom

Successful elimination of thermal risks requires more than just buying equipment—it demands precise engineering calculation. It is necessary to consider the specific architecture of particular AI models, rack configuration, and existing data center building limits.

As the official distributor of STULZ, the Softprom team provides a full cycle of expert support: from the initial audit of thermal profiles and simulation of air/liquid flows to the selection of the optimal configuration of precision equipment.